Automatic peeling device for protective film for printed circuit boards.
By automating the peeling process of various protective films for inline-produced package substrates and automotive substrates, it is possible to reduce labor and improve productivity.
【Product Features】 ○ Clean Release By eliminating the use of air blow, chip flying can be reduced to create a release trigger. ○ No Setup Required No need for setup changes based on the thickness and size of the substrate. ○ Compatible with Ultra-Thin Substrates (Material Thickness: 0.025mm) Equipped with substrate clamps, it can handle ultra-thin plates that were difficult to release with conventional equipment. ○ Compatible with Difficult-to-Release Materials Please consult us regarding difficult-to-release materials such as ABF for PKG substrates and solder resist. ○ Built-in NG Stocker Film remnants are automatically detected by sensors and stored in the NG stocker. ○ Clean Specification Support (Additional Option) Downflow using HEPA filters is also possible. We can conduct release tests with demo machines and consider special support for thin substrates, large substrates, and special films, so please feel free to contact us.
- Company：アドテックエンジニアリング
- Price：Other
